✦ Usage
Designed to provide long term bonding and to protect against moisture, environmental attack, mechanical and thermal shock as well as vibration especially where a high strength product is required.
Typical applications include: bonding of sensitive electronic components and sub-assemblies.
✦ Features
Excellent moisture, dust and corona proof, cushion and earthquake proof .
One-component, easy handling.
Cured fast within 10mins.
Good adhesion to most substrates.
No corrosion to most material, eg. Metal Cu and PU plastic.
Stable and flexible at the temperature -60° C to +250°C.